The best reputable distributor of liquid level transmitter (5 minutes ago).
Display the installation method of the base flange connector and the size of the base flange connection.
It is a machine that is installed by installing sensor or fixtures on the substrate. It includes k, N, F, Ba
The BD-LS210 strain sensor/strain sensor is designed with a metal substrate and is the main application of plastic panel type sensor. It has the characteristics and characteristics of various sizes and materials, and can be applied in various testing fields.
Due to its dedicated Σ- △ modulus, therefore, weights are generally written directly towards key or differential. Different sensor are suitable for different label categories, such as DIP (number of printed circuit boards) or printed circuit board cover plate. Printed circuit board cover plate and DIP packaging circuit board cover plate. Printed circuit board tin substrate auxiliary circuit sealing substrate. Printed circuit board welding technology. Microelectronics technology is applied to optoelectronic sensor manufacturers of power semiconductors. See more.
FAST H94, Flipft MAF M2 series/vertical installation.
Project Introduction: The company was established in 2019 and is an innovative and entrepreneurial company. The company has a first-class team of overseas and domestic experts, focusing on advanced power semiconductor chips and IPM intelligent modules.
Utilizing the team's rich experience and intellectual property in the field of new energy vehicle electronics, with the support of capital and platform resources, the company operates the advanced power device+new energy vehicle industry chain, integrating core component construction, research and development, and industry chain resources such as ultrasonic motors, motors, switches, and automotive electronics. The company has advanced registered capital and officially passed ISO 7724 certification for mechanical engineers (Rutton) and MEMS in 1997, completing ISO 9001 and ISO 1128 certifications.
Project Introduction: The company was established in 2019 and is an innovative and entrepreneurial company. The company has a first-class team of overseas and domestic experts, focusing on advanced power devices and new energy vehicle electronic technology, research and development capabilities and strength, focusing on the field of artificial intelligence. It has rich product mass production in the semiconductor new energy field and actively participates in overseas research and development. The company's unique vision is to create a new workshop for the production of high-end cars in the future.
Project Introduction: There are three main directions for product and technology research and development. Firstly, high-speed and high-precision ADC and DAC core key technologies, as well as product and IP research and development; Secondly, linear displacement measurement series chips, high-end instrument chips, and industrial IoT chips are used in the field of intelligent equipment; The third is high-end medical electronic chips represented by CT chips.
The best reputable distributor of liquid level transmitter (5 minutes ago).
Display the installation method of the base flange connector and the size of the base flange connection.
It is a machine that is installed by installing sensor or fixtures on the substrate. It includes k, N, F, Ba
The BD-LS210 strain sensor/strain sensor is designed with a metal substrate and is the main application of plastic panel type sensor. It has the characteristics and characteristics of various sizes and materials, and can be applied in various testing fields.
Due to its dedicated Σ- △ modulus, therefore, weights are generally written directly towards key or differential. Different sensor are suitable for different label categories, such as DIP (number of printed circuit boards) or printed circuit board cover plate. Printed circuit board cover plate and DIP packaging circuit board cover plate. Printed circuit board tin substrate auxiliary circuit sealing substrate. Printed circuit board welding technology. Microelectronics technology is applied to optoelectronic sensor manufacturers of power semiconductors. See more.
FAST H94, Flipft MAF M2 series/vertical installation.
Project Introduction: The company was established in 2019 and is an innovative and entrepreneurial company. The company has a first-class team of overseas and domestic experts, focusing on advanced power semiconductor chips and IPM intelligent modules.
Utilizing the team's rich experience and intellectual property in the field of new energy vehicle electronics, with the support of capital and platform resources, the company operates the advanced power device+new energy vehicle industry chain, integrating core component construction, research and development, and industry chain resources such as ultrasonic motors, motors, switches, and automotive electronics. The company has advanced registered capital and officially passed ISO 7724 certification for mechanical engineers (Rutton) and MEMS in 1997, completing ISO 9001 and ISO 1128 certifications.
Project Introduction: The company was established in 2019 and is an innovative and entrepreneurial company. The company has a first-class team of overseas and domestic experts, focusing on advanced power devices and new energy vehicle electronic technology, research and development capabilities and strength, focusing on the field of artificial intelligence. It has rich product mass production in the semiconductor new energy field and actively participates in overseas research and development. The company's unique vision is to create a new workshop for the production of high-end cars in the future.
Project Introduction: There are three main directions for product and technology research and development. Firstly, high-speed and high-precision ADC and DAC core key technologies, as well as product and IP research and development; Secondly, linear displacement measurement series chips, high-end instrument chips, and industrial IoT chips are used in the field of intelligent equipment; The third is high-end medical electronic chips represented by CT chips.
